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Laser Cleaning Solution
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Laser Cleaning Solution

Dry Laser Cleaning Solution for Semi-Conductor

Using the World's First Short Pulse Mid-IR Fiber Laser
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High-precision laser cleaning powered by the only 3µm pulsed fiber lasers on the market

Benefits

  • Time-saving
  • Productivity improvement
  • Process automation
  • Efficient and accurate process

Advantages

  • Robust software integration in DMC.
  • Quickly integrates through partners such as Ficontec.
  • Less manipulation which reduce QA inspection rejections.
  • On-site installation, reducing part handling.
  • 2.8um enables selective removal of organic residues while preserving the substrate.

Why our dry laser cleaning solution is better?

 

 

Current cleaning methods, like ultrasonic baths and repeated validations, do not always remove all residues, which lead to QA inspection rejections.

Also, these manual processes increase the risk of wafer breakage and result in efficiency losses.

 

- Dust particles

- Isopropanol residue

- Organic removal

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